Feature size is determined by the width of the smallest lines that can be patterned in a semiconductor fabrication process, this measurement is … See more

When feature widths were far greater than about 10 micrometres, semiconductor purity was not as big of an issue as it is today in device … See more

In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and … See more

20th century
An improved type of MOSFET technology, CMOS, was developed by Chih-Tang Sah and See more

This is a list of processing techniques that are employed numerous times throughout the construction of a modern electronic device; this list does not necessarily imply a specific order, nor that all techniques are taken during manufacture as, in practice the order and which … See more

A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 300 mm (slightly less … See more

The highly serialized nature of wafer processing has increased the demand for metrology in between the various processing steps. For example, thin film metrology based on ellipsometry or reflectometry is used to tightly control the thickness of gate … See more