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  2. Processes Performed Semiconductor foundry services perform processes such as chemical mechanical polishing (CMP), physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing, dry etching, wet etching, photolithography, wafer level packaging, and via forming or filling.
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    Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). It is a multiple-step photolithographic and physio-chemical process … See more

    Feature size is determined by the width of the smallest lines that can be patterned in a semiconductor fabrication process, this measurement is … See more

    When feature widths were far greater than about 10 micrometres, semiconductor purity was not as big of an issue as it is today in device manufacturing. In the 1960s, workers could … See more

    In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and … See more

    20th century
    An improved type of MOSFET technology, CMOS, was developed by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor See more

    This is a list of processing techniques that are employed numerous times throughout the construction of a modern electronic device; this list … See more

    A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm … See more

    The highly serialized nature of wafer processing has increased the demand for metrology in between the various processing steps. For example, thin film metrology based on See more

     
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